Product Description
Copper Powder
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7440-50-8
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Flake, Spherical；Copper red powder
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99.9% Min
Product name: Copper Powder
Morphology: Flake, Spherical
Appearance: Copper red powder
Cu content: 99.9% min
Features:
It is suitable for alcohols, weak acid resins and additives. It has good conductivity, excellent screen printing, dispersion and oxidation resistance.
Application:
1. conductive paste
2. conductive adhesive
3. electromagnetic shielding material
4. conductive rubber
5. conductive plastic
6. low temperature electronic paste
Specifications：
|
Grade |
Morphology |
Particle size distribution (μm) |
Bulk density (g/cm3) |
Tapped density (g/cm3) |
Moisture (%) |
Specific surface area (m2/g) |
||
|
D10 |
D50 |
D90 |
||||||
|
ATPN-C-1 |
Spherical |
≥ 0.5 |
1.5~2.5 |
≤3.5 |
2.0~2.4 |
3.8~4.3 |
≤ 0.2 |
0.8~0.9 |
|
ATPN-C-1A |
Spherical |
≥2.0 |
3.8~4.2 |
≤7.0 |
3.0~3.5 |
4.5~4.8 |
≤ 0.2 |
0.3~0.4 |
|
ATPN-C-1A (Spheroidized) |
Spherical |
≥2.0 |
3.8~4.2 |
≤7.0 |
3.0~3.5 |
4.5~4.8 |
≤0.2 |
0.3~0.4 |
|
ATPN-C-2 |
Spherical |
≥2.5 |
5.0~6.0 |
≤10.0 |
3.0~3.5 |
4.5~4.8 |
≤ 0.2 |
0.25~0.3 |
|
ATPN-C-2 (Spheroidized) |
Spherical |
≥2.5 |
5.0~6.0 |
≤10.0 |
3.0~3.5 |
4.5~4.8 |
≤0.2 |
0.25~0.3 |
|
ATPN-PC-1 |
Flake |
≥2.0 |
3.0~4.0 |
≤7.0 |
2.0~2.5 |
4.2~4.6 |
≤0.2 |
0.4~0.5 |
|
ATPN-PC-2 |
Flake |
≥4.0 |
6.5~7.5 |
≤12 |
2.4~2.7 |
4.5~5.0 |
≤0.2 |
0.35~0.4 |
Package: 1kg /bag, 25kg/drum or as your special request
