Product name: Dendritic Silver-Coated Copper Powder

Morphology: Dendritic

Appearance: Copper red to silvery white powder

Ag content: 3%-18.5%

Description:

Dendritic Silver-Coated Copper Powder is a specialized type of powder that consists of copper particles coated with a layer of silver. The term "dendritic" refers to the unique branching or tree-like structure that the silver coating forms on the surface of the copper particles.
This powder combines the electrical conductivity of copper with the enhanced properties of silver, making it a versatile and valuable material in various applications. The silver coating provides additional benefits such as improved corrosion resistance, enhanced thermal conductivity, and excellent solderability.
Dendritic Silver-Coated Copper Powder is commonly used in the electronics industry for applications that require high electrical conductivity, such as conductive inks, pastes, and adhesives. It is also utilized in the production of electronic components, including printed circuit boards (PCBs), semiconductor devices, and connectors.
The unique dendritic structure of the silver coating ensures a large surface area, allowing for effective contact and improved performance in applications where conductivity and reliability are crucial. Additionally, the combination of copper and silver offers a cost-effective alternative to using pure silver while maintaining desirable electrical and thermal properties.
Overall, Dendritic Silver-Coated Copper Powder offers a balance of electrical conductivity, corrosion resistance, and cost-effectiveness, making it a preferred choice in various electronic and conductive applications.

Features:

1. High Conductivity: Copper is known for its excellent electrical conductivity, and the dendritic structure of the powder further enhances its conductivity. The silver coating adds to the overall conductivity, making it suitable for applications that require efficient electrical pathways.
2. Enhanced Surface Area: The dendritic structure of the powder particles provides a large surface area, which is beneficial for improved adhesion and contact with other materials. This allows for better conductivity and enhanced performance in applications like conductive inks or coatings.
3. Electromagnetic Shielding: The combination of copper and silver in Dendritic Silver-Coated Copper Powder enables effective electromagnetic shielding properties. The dendritic structure and conductive properties make it suitable for applications where electromagnetic interference (EMI) shielding is required.
4. Antimicrobial Properties: The silver coating on the copper particles gives Dendritic Silver-Coated Copper Powder antimicrobial properties. It inhibits the growth of bacteria and other microorganisms, making it useful for applications where preventing microbial growth is desired, such as in antimicrobial coatings or medical devices.
5. Thermal Conductivity: Copper has excellent thermal conductivity, and the dendritic structure of the powder particles enhances heat transfer capabilities. This makes Dendritic Silver-Coated Copper Powder suitable for thermal management applications where efficient heat dissipation is essential.
6. Catalytic Potential: The unique structure and composition of Dendritic Silver-Coated Copper Powder make it potentially suitable as a catalyst in various chemical reactions. It can exhibit catalytic activity in processes such as electrochemical reactions or other catalytic applications.
7. Excellent oxidation resistance: Dendritic Silver-Coated Copper Powder generally exhibits good oxidation resistance due to the protective silver coating. The silver layer acts as a barrier between the copper core and the surrounding environment, helping to prevent direct oxidation of the copper particles.

Applications:

1. Conductive Inks and Pastes

Dendritic Silver-Coated Copper Powder can be utilized in the formulation of conductive inks and pastes used in printed electronics, such as printed circuit boards (PCBs), RFID tags, and flexible electronics. It provides a large surface area, enabling better conductivity and adhesion to various substrates.
2. Electromagnetic Shielding
The combination of copper's conductivity and silver's enhanced performance makes Dendritic Silver-Coated Copper Powder suitable for electromagnetic shielding applications. It can be incorporated into coatings, paints, or composites to provide effective shielding against electromagnetic radiation.
3. Antimicrobial Coatings
Silver has antimicrobial properties, and when coated onto copper particles with a dendritic structure, it enhances the material's ability to inhibit the growth of bacteria and other microorganisms. Dendritic Silver-Coated Copper Powder can be incorporated into coatings for various surfaces, such as medical devices, touchscreens, door handles, and other high-touch surfaces to help prevent the spread of infections.
4. Thermal Interface Materials
The dendritic structure of the powder particles allows for improved contact and enhanced thermal conductivity. Dendritic Silver-Coated Copper Powder can be used in thermal interface materials to improve heat transfer between electronic components and heat sinks or other cooling devices.
5. Catalysis
The unique structure and composition of Dendritic Silver-Coated Copper Powder can make it potentially suitable as a catalyst in various chemical reactions, such as electrochemical processes, hydrogenation, or other catalytic reactions.
6. Conductive coating
Conductive coating, conductive adhesive, conductive lubricant and conductive rubber.

Specifications：

Grade	Morphology	Silver content (wt %)	Particle size distribution (um)			Apparent density (g/cm3)	Tap density (g/cm3)	Moisture (%)	Total oxygen content (wt %)
			D10	D50	D90
EAC-1	Dendritic	5~30	≥1.4	6.0~8.0	≤20.0	0.6~1.0	1.6~1.8	≤0.2	≤0.30
D-CuAg-2	Dendritic	3~18%		35um

Storage: Store in a cool, dry, ventilated place.

Package: 1kg /bag, 25kg/drum or as your special request