Product name: Silver Coated Copper Powder
Morphology: Flake
Appearance: Light copper red / Silver with red / silvery white powder
Ag content: 3%-30%
Description:
Flake silver-coated copper powder is a unique type of powder consisting of copper particles that are coated with a layer of silver. This coating process provides the powder with enhanced properties and versatile applications.Features:
1. Enhanced conductivity: The silver coating on the copper particles significantly improves the electrical conductivity of the powder. It allows for efficient transfer of electrical current, making it ideal for applications that require high conductivity.
2. Improved thermal properties: The silver coating also enhances the thermal conductivity of the copper powder, enabling efficient heat dissipation. This feature makes it suitable for applications that involve heat management or thermal conductivity requirements.
3. Corrosion resistance: The silver coating provides a protective layer that helps prevent corrosion of the underlying copper particles. This feature enhances the powder's durability and ensures long-term performance in challenging environments.
4. Solderability: The flake silver-coated copper powder exhibits excellent solderability, making it easily integrable into soldering processes. This feature enables reliable and efficient connections in electronic assembly and soldering applications.
5. Versatility: The powder's unique flake shape and combination of copper and silver properties make it versatile for various applications. It can be used as a conductive additive in coatings, inks, and adhesives, or as a component in printed circuit boards, electromagnetic shielding, and other electronic devices.
6. Compatibility: Flake silver-coated copper powder is compatible with different substrates and materials commonly used in electronic and electrical applications. It can be easily incorporated into existing manufacturing processes and formulations.
7. Particle size control: The powder is available in different particle sizes, allowing for customization and optimization based on specific application requirements.
Applications:
1. Conductive coatings
The powder is used as a conductive additive in coatings and paints, especially those requiring high electrical conductivity. It helps improve the conductivity of the coating, making it suitable for applications such as printed electronics, electromagnetic shielding, and antistatic coatings.
2. Printed circuit boards (PCBs)
Flake silver-coated copper powder is used in the production of PCBs to enhance the conductivity of circuit traces and pads. It allows for reliable electrical connections and efficient signal transmission in electronic devices.
3. Electronic adhesives
The powder is incorporated into conductive adhesives and bonding materials to improve their electrical conductivity. It ensures strong and reliable bonds in electronic component assembly and bonding applications.
4. Electrical contacts
Flake silver-coated copper powder is utilized in the manufacturing of electrical contacts, connectors, and switches. It enables excellent electrical conductivity and helps maintain reliable contact and low resistance over time.
5. Thermal management
Due to its enhanced thermal conductivity, the powder is used in thermal interface materials and heat dissipation applications. It aids in efficient heat transfer, enabling effective cooling of electronic components and systems.
6. Additive manufacturing
The powder can be utilized in additive manufacturing processes, such as 3D printing, to create conductive structures and components. It enables the production of intricate conductive patterns and functional parts with high conductivity.
7. EMI/RFI shielding
Flake silver-coated copper powder is employed in electromagnetic interference (EMI) and radiofrequency interference (RFI) shielding applications. It helps create conductive coatings or materials that block or redirect electromagnetic waves, reducing interference and ensuring signal integrity.
Specifications:
Apparent
density
(g/cm3)
Total oxygen
content
(wt %)
Grade
Morphology
Silver content (wt %)
Particle size distribution (um )
Tap density (g/cm3)
Moisture (%)
D10
D50
D90
PAC-1
Flake
10~30
≥1.2
3.0~3.5
≤6.5
2.0~2.5
3.2~3.6
≤0.2
≤0.2
PAC-2
Flake
10~30
≥2.6
6.5~7.0
≤15.0
2.6~2.9
4.4~4.6
≤0.2
≤0.2
Li-0103
Flake
3
5.5~7.8
26.3~30.5
48.5~51.7
1.25~1.35
2.2~2.44
Li-0105
Flake
5
5.5~7.8
26.3~30.5
48.5~51.7
1.25~1.35
2.2~2.44
Li-0110
Flake
10
5.5~7.8
26.3~30.5
48.5~51.7
1.08~1.2
2.1~2.34
Storage: Store in a cool, dry, ventilated place.
Package: 1kg /bag, 25kg/drum or as per your particular request