Product name: Silver Coated Copper Powder

Morphology: Spherical

Appearance: Light copper red / Silver with red / silvery white powder

Ag content: 3%-30%

Description:

Spherical Silver-Coated Copper Powder is a specialized type of powder consisting of copper particles with a spherical shape that are coated with a layer of silver. This unique combination of copper and silver offers distinct properties and applications.
The spherical shape of the particles provides several advantages. It offers improved flowability, making it easier to handle and process in various applications. The uniform shape also contributes to better packing density, ensuring efficient usage of the powder.
The silver coating on the copper particles enhances the powder's conductivity, making it suitable for applications requiring electrical conductivity or thermal conductivity. The silver coating also provides excellent corrosion resistance, protecting the underlying copper material from oxidation and degradation.
Spherical Silver-Coated Copper Powder finds applications in various fields. It is commonly used in conductive pastes and inks for printed electronics, where it serves as a conductive filler material. It can be incorporated into coatings, adhesives, and sealants to impart conductivity or enhance their performance. Additionally, it is utilized in the production of conductive films, soldering materials, and electromagnetic shielding components.
The unique combination of copper and silver in this powder offers versatility, enabling it to be tailored for specific requirements in different industries. Its electrical and thermal conductivity, corrosion resistance, and spherical shape make it a valuable material in various technological applications.

Features:

1.Spherical shape: The particles have a uniform spherical shape, which enhances their flowability, packing density, and ease of handling.
2.Conductivity: The silver coating on the copper particles provides excellent electrical conductivity, making it suitable for applications that require conductive properties.
3.Thermal conductivity: The powder exhibits good thermal conductivity, allowing it to dissipate heat efficiently in thermal management applications.
4.Corrosion resistance: The silver coating protects the underlying copper material from oxidation and corrosion, ensuring long-term stability and durability.
5.Versatility: The powder can be customized and tailored to meet specific conductivity and application requirements.
6.Enhanced performance: Incorporating Spherical Silver-Coated Copper Powder into coatings, adhesives, and other materials can improve their conductivity, thermal management, and overall performance.
7.Compatibility: It is compatible with various matrix materials such as polymers, resins, and solvents, allowing for easy integration into different formulations.
8.Controlled particle size: The powder is available in a range of particle sizes, offering flexibility in achieving desired properties and performance.
9.Application versatility: It finds applications in printed electronics, conductive inks, coatings, adhesives, soldering materials, electromagnetic shielding, and other technology-driven industries.

Applications:

1.Conductive Inks
The powder is used in the formulation of conductive inks for printed electronics, such as flexible circuits, RFID tags, and touch sensors.
2.Coatings
It is employed in the production of conductive coatings for applications like EMI/RFI shielding, anti-static coatings, and corrosion protection coatings.
3.Adhesives and Sealants
The powder is added to adhesives and sealants to enhance conductivity, allowing for effective bonding in electronic assemblies.
4.Thermal Management
It is utilized in thermal interface materials, heat sinks, and thermal adhesives to improve heat dissipation and thermal conductivity in electronic devices.
5.Soldering Materials
The powder is incorporated into solder pastes and fluxes to improve conductivity and solder joint reliability.
6.Printed Electronics
It is used in the fabrication of printed circuit boards (PCBs), flexible electronics, and other printed electronic components.
7.Electromagnetic Shielding
The powder is employed in the production of electromagnetic shielding materials to protect sensitive electronic devices from electromagnetic interference (EMI).
8.Additive Manufacturing
It finds application in metal 3D printing processes, where it can enhance the electrical and thermal conductivity of printed parts.
9.Catalysts
The powder is utilized as a catalyst in certain chemical reactions due to its conductive and catalytic properties.

Specifications：

Grade	Morphology	Silver content (wt %)	Particle size distribution (um )			Apparent density (g/cm3)	Tap density (g/cm3)	Moisture (%)	Total oxygen content (wt %)
			D10	D50	D90
AC-1	Spherical	10~30	≥ 0.5	1.8~2.2	≤ 3.5	2.4~2.6	4.0~4.5	≤0.2	≤0.30
AC-1A	Spherical	10~30	≥ 1.4	3.8~4.2	≤ 7.0	2.5~2.8	4.4~4.6	≤0.2	≤0.20
AC-2	Spherical	10~30	≥ 1.5	4.5~5.0	≤ 8.5	2.8~3.0	4.5~4.8	≤0.2	≤0.20

Storage: Store in a cool, dry, ventilated place.

Package: 1kg /bag, 25kg/drum or as per your particular request