Conductive tape is a type of metal foil or conductive fabric with a highly conductive adhesive on the back. The conductive adhesive and conductive substrate form a complete conductive body, enabling electrical interconnection and gap sealing through adhesive bonding with any metal surface. This adhesive contains conductive particles, typically nickel powder, which is crucial for its conductivity.

Conductive tape is an economical and convenient shielding material. It can be used to seal EMI shielding chambers, joints in casings and electronic devices, as well as for shielding wrapped cables. Additionally, conductive tape can provide a reliable grounding surface and offer electrical contact to surfaces that cannot be welded. Conductive tape plays a vital role in the microelectronics and integrated circuit industry, finding widespread application in various electronic and electrical products such as computers, smartphones, wires, cables, especially in high-frequency transmission where it effectively shields or isolates electromagnetic or radiofrequency interference.

Key advantages of conductive tape:

Firstly, conductive tape exhibits excellent adhesive properties, ensuring a secure and reliable connection between components like flexible printed circuit boards and metal enclosures. This robust adhesive capability not only guarantees a sturdy connection between components but also ensures stability and durability during the use of electronic devices.

Secondly, conductive tape possesses outstanding conductivity, effectively balancing potential and releasing static charges. In microelectronic integrated circuits, the accumulation of static charges can lead to serious issues such as short circuits, and conductive tape effectively addresses this problem, ensuring the normal operation of circuits.

Furthermore, conductive tape has good weather resistance and chemical stability, maintaining stable performance in various harsh environments. This widespread application in the microelectronics and integrated circuit industry provides robust support for the manufacturing of various portable electronic devices.

Nickel powder exhibits excellent chemical stability, effective electromagnetic interference resistance, and a moderate price, making it the most popular material in conductive tape products. Dendritic conductive nickel powder is a special conductive material with the following characteristics:

Appearance: Dendritic conductive nickel powder is a dark gray powder.

High Purity: Dendritic conductive nickel powder usually has high purity, with a Ni content greater than 99.5%.

Excellent Conductivity: The dendritic structure contributes to the formation of a well-connected conductive network, resulting in excellent conductivity.

Good Dispersibility: Dendritic conductive nickel powder can uniformly disperse in various media, facilitating its application in conductive tape.

In conductive tape, dendritic conductive nickel powder can be used as a conductive filler. By uniformly dispersing dendritic conductive nickel powder in the tape substrate, conductive tape can achieve excellent conductivity. Moreover, the chain-like structure of dendritic conductive nickel powder enhances the conductive stability of the tape under deformation conditions such as bending and stretching.

Specifically, the application of branched conductive nickel powder in conductive tape is as follows:

First, mix dendritic conductive nickel powder with an appropriate amount of dispersant, binder, and other auxiliary materials to form a conductive slurry. Then, evenly coat the tape substrate with the conductive slurry, and through drying and curing processes, firmly attach the dendritic conductive nickel powder to the tape substrate. Finally, process the tape coated with dendritic conductive nickel powder through cutting, winding, and other processing steps to obtain the finished conductive tape.

It is important to note that when using dendritic conductive nickel powder to produce conductive tape, factors such as the amount of dendritic conductive nickel powder, the type and quantity of dispersant, and the type and quantity of binder should be controlled to ensure that the conductive tape's conductivity and mechanical properties are optimized.

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