Product name: Diethoxy(methyl)(3-(oxiran-2-ylmethoxy)propyl)silane
CAS 2897-60-1
Molecular Formula: C11H24O4Si
Purity: 97.0% Min
Appearance: Clear Liquid
Specifications:
|
Name |
Diethoxy(methyl)(3-(oxiran-2-ylmethoxy)propyl)silane |
|
CAS |
2897-60-1 |
|
Molecular Formula |
C11H24O4Si |
|
Molecular Mass |
248.391 |
|
EINECS |
220-780-8 |
|
Purity |
97.0% Min |
|
Density |
1.0±0.1 g/cm3 |
|
Boiling Point |
284.7±20.0 °C at 760 mmHg |
|
Melting Point |
< 0oC |
|
Flash Point |
100.2±22.2 °C |
|
Vapour Pressure |
0.0±0.6 mmHg at 25°C |
|
Index of Refraction |
1.440 |
|
Other Names
|
γ-Glycidoxypropylmethyldiethoxysilane (3-Glycidoxypropyl)methyldiethoxysilane diethoxy[3-(glycidyloxy)propyl]methylsilane |
Applications:
1. Adhesion Promotion:
Enhances wet-adhesion in waterborne coatings (acrylic, PU), sealants, and adhesives for automotive, marine, and furniture industries.
2. Composite Materials:
Treats glass fibers/fillers in unsaturated polyesters to improve mechanical strength, electrical properties, and light transmission—especially in humid conditions.
3. Electronics:
Used in electronic encapsulation/packaging to enhance dielectric properties.
4. Cable Industry:
Modifies EPDM rubber filled with clay to reduce inductance/capacitance losses.