Product name: Diethoxy(methyl)(3-(oxiran-2-ylmethoxy)propyl)silane
CAS 2897-60-1
Molecular Formula: C11H24O4Si
Purity: 97.0% Min
Appearance: Clear Liquid
	
 
Specifications:
| 
					 Name  | 
				
					 Diethoxy(methyl)(3-(oxiran-2-ylmethoxy)propyl)silane  | 
			
| 
					 CAS  | 
				
					 2897-60-1  | 
			
| 
					 Molecular Formula  | 
				
					 C11H24O4Si  | 
			
| 
					 Molecular Mass  | 
				
					 248.391  | 
			
| 
					 EINECS  | 
				
					 220-780-8  | 
			
| 
					 Purity  | 
				
					 97.0% Min  | 
			
| 
					 Density  | 
				
					 1.0±0.1 g/cm3  | 
			
| 
					 Boiling Point  | 
				
					 284.7±20.0 °C at 760 mmHg  | 
			
| 
					 Melting Point  | 
				
					 < 0oC  | 
			
| 
					 Flash Point  | 
				
					 100.2±22.2 °C  | 
			
| 
					 Vapour Pressure  | 
				
					 0.0±0.6 mmHg at 25°C  | 
			
| 
					 Index of Refraction  | 
				
					 1.440  | 
			
| 
					 Other Names 
						  | 
				
					 γ-Glycidoxypropylmethyldiethoxysilane (3-Glycidoxypropyl)methyldiethoxysilane diethoxy[3-(glycidyloxy)propyl]methylsilane  | 
			
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
 
	
Applications:
1. Adhesion Promotion:
Enhances wet-adhesion in waterborne coatings (acrylic, PU), sealants, and adhesives for automotive, marine, and furniture industries.
2. Composite Materials:
Treats glass fibers/fillers in unsaturated polyesters to improve mechanical strength, electrical properties, and light transmission—especially in humid conditions.
3. Electronics:
Used in electronic encapsulation/packaging to enhance dielectric properties.
4. Cable Industry:
Modifies EPDM rubber filled with clay to reduce inductance/capacitance losses.